• System Bus PCIe x1;
• Support of up to 2 single size mezzanine boards and 1 double size mezzanine board
• "Hot swap" of modules
• Availability of rear output of signals form the module
• Developer kit on the basis of M551T for the development of
• proprietary mezzanine boards;
• Operating temperature range: –40…+85°С
• Relative humidity: up to 95% at +25°С
3U DIC551 mezzanine carrier module with front output
4U DIC551mezzanine module with the rear output and conductive heat removal
Mezzanine of RS-485/422/232 interfaces with the front I/O
Mezzanine of RS-485/422/232 interfaces with the rear I/O
Digital I/O mezzanine with the front I/O
Digital I/O mezzanine with the rear I/O
Mezzanine of the current loop interfaces with the front I/O
Mezzanine of the current loop interfaces with the rear I/O